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January 2, 2018

Robert A.M. Stern Architects Announces 2018 RAMSA Travel Fellowship Call for Proposals

Robert A.M. Stern Architects Announces 2018 RAMSA Travel Fellowship Call for Proposals
The call for proposals for the sixth annual RAMSA Travel Fellowship was released this month.

The RAMSA Travel Fellowship is a $10,000 prize awarded annually by the Partners of Robert A.M. Stern Architects for the purpose of travel and research. More specifically, the Fellowship seeks to promote investigations of the perpetuation of tradition through invention – key to the firm’s own work. The prize is intended to nurture emerging talent and will be awarded to an individual who has proven insight and interest in the profession and its future, as well as the ability to carry forth the in-depth research proposed.

The RAMSA Travel Fellowship is open to graduate students in their penultimate year of a professional or post-professional degree program in architecture at one of the twenty design schools in the United States and Canada that RAMSA has chosen to partner with, eligible due to their strong historical relationships with the firm. These schools are: Columbia University; Cornell University; Harvard University; Massachusetts Institute of Technology; McGill University; Pratt Institute; Princeton University; Rhode Island School of Design; Rice University; Syracuse University; University of California, Berkeley; University of California, Los Angeles; University of Miami; University of Michigan; University of Minnesota; University of Notre Dame; University of Pennsylvania; University of Texas at Austin; University of Virginia; and Yale University.

Previous winners have traveled to Austria, Slovenia, Italy, Kenya, Japan, India, Scotland, and the United States to study a range of topics, from catenary vaulting and traditional wood joinery to vernacular forms and historical styles.

Submissions are due on April 13th, 2018, and the RAMSA Travel Fellowship jury will announce the winner on April 20th, 2018.

Interested students can download the 2018 application package at

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